THERMAL PASTE 30mq
10.00 AZN
Heat accumulated in the gaps between the processor and cooler is transferred to the cooler. It has high insulation properties and high thermal conductivity. Used as a paste. Applicable in graphics cards, RAM, processors, and chips. Low thermal resistance. Thermal conductivity: 1.0 W/m-kN.W Thermal resistance: 0.316 C Weight: 30 g
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